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 FGD2N40L 400V N-Channel Logic Level IGBT
March 2006
FGD2N40L
400V N-Channel Logic Level IGBT
Features
VCE(SAT) = 1.6V @ IC = 2.5A, VGE = 2.4V 6kV ESD Protected High Peak Current Density TO-252 (D-Pak) Low VGE(TH)
General Description
This N-Channel IGBT is a MOS gated, logic level device which has been especially tailored for small engine ignition applications. The gate is ESD protected with a zener diode.
Applications
Small Engine Ignition Applications
(c)2006 Fairchild Semiconductor Corporation FGD2N40L Rev. A
1
www.fairchildsemi.com
FGD2N40L 400V N-Channel Logic Level IGBT
Device Maximum Ratings TA= 25C unless otherwise noted
Symbol BVCES IC ICP VGES VGEP PD TJ TSTG ESD Parameter Collector to Emitter Breakdown Voltage Collector Current Continuous(DC) Collector Current Pulsed(100s) Gate to Emitter Voltage Continuous(DC) Gate to Emitter Voltage Pulsed Power Dissipation Total TC = 25oC Operating Junction Temperature Range Storage Junction Temperature Range Electrostatic Discharge Voltage at 100pF, 1500 Ratings 400 7 29 8 10 29 -40 to 150 -40 to 150 6 Units V A A V V W C C kV
Package Marking and Ordering Information
Device Marking FGD2N40 Device FGD2N40L Package D-PAK Tape Width 12mm / 16mm Quantity 2500
Electrical Characteristics TA = 25C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BVCES BVGES ICES IGES Collector to Emitter Breakdown Voltage Gate-Emitter Breakdown Voltage Collector to Emitter leakage Current Gate-Emitter Leakage Current IC = 1mA, VGE = 0V IGES = 1mA VCE = 320V VGE = 8 TC = +25oC 400 10 TC = +125oC 10 250 10 V V A A A
On Characteristics
VCE(SAT) Collector to Emitter Saturation Voltage IC = 2.5A, VGE = 2.4V(NOTE1) 1.3 1.6 V
Dynamic Characteristics
QG(ON) VGEP VGE(TH) CIES RG Gate Charge Gate to Emitter Plateau Voltage Gate to Emitter Threshold Voltage Input Capacitance Internal Gate Series Resistance IC = 2.5A, VCE = 300V, VGE = 10V IC = 2.5A, VCE = 300V IC = 1.0mA, VCE = VGE VCE = 10V, VGE = 0V, f =1MHz 0.70 11 1.8 0.85 357 300 1.2 nC V V pF ohms
Switching Characteristics
tON td(ON)I trI tOFF td(OFF)I tfI Turn-On Time Current Turn-On Delay Time Current Rise Time Turn-Off Time Current Turn-Off Delay Time Current Fall Time VCC = 300V, IC = 2.5A, VGE = 4V, RL = 120, RG = 51, TJ = 25oC 0.142 0.047 0.095 2.152 0.650 1.529 s s s s s s
Thermal Characteristics
RJC Thermal Resistance Junction-Case TO-252 (D-Pak) 4.29 C/W
Notes: 1: Pulse Duration = 100 sec
2 FGD2N40L Rev. A
www.fairchildsemi.com
FGD2N40L 400V N-Channel Logic Level IGBT
Typical Performance Characteristics
ICE, COLLECTOR TO EMITTER CURRENT (A)
25
Waveforms in descending order V GE = 8V V GE = 6V V GE = 5V V GE = 4V V GE = 3.5V V GE = 2.4V V GE = 2.2V V GE = 2V
ICE, COLLECTOR TO EMITTER CURRENT (A)
30
30 Waveforms in descending order V GE = 8V V GE = 6V 20 V GE = 5V V GE = 4V V GE = 3.5V 15 V GE = 2.4V V GE = 2.2V 10 V GE = 2V
25
20
15
10
5
T J = -40 C PULSE DURATION = 100s
o
5
T J = 25 C PULSE DURATION = 100s
o
0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
V CE, COLLECTOR TO EMITTER VOLTAGE (V)
V CE, COLLECTOR TO EMITTER VOLTAGE (V)
Figure 1. Collector Current Vs. Collector to Emitter On-State Voltage
Figure 2. Collector Current Vs. Collector to Emitter On-State Voltage
ICE, COLLECTOR TO EMITTER CURRENT (A)
25
W aveforms in descending order V GE = 8V V GE = 6V V GE = 5V V GE = 4V V GE = 3.5V V GE = 2.4V V GE = 2.2V V GE = 2V
ICE, COLLECTOR TO EMITTER CURRENT (A)
30
30 Waveforms in descending order V GE = 8V V GE = 6V 20 V GE = 5V V GE = 4V V GE = 3.5V 15 V GE = 2.4V V GE = 2.2V 10 V GE = 2V
25
20
15
10
5
T J = 70 C PULSE DURATION = 100s
o
5
T J = 125 C PULSE DURATION = 100s
o
0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
V CE , COLLECTOR TO EMITTER VOLTAGE (V)
VCE, COLLECTOR TO EMITTER VOLTAGE (V)
Figure 3. Collector Current Vs. Collector to Emitter On-State Voltage
Figure 4. Collector Current Vs. Collector to Emitter On-State Voltage
VCE, COLLECTOR TO EMITTER VOLTAGE (V)
VCE, COLLECTOR TO EMITTER VOLTAGE (V)
3.5 V GE = 4V 3.0 PULSE DURATIO N = 100s ICE = 15A 2.5
3.5 V GE = 5V 3.0 PULSE DURAT IO N = 100s ICE = 15A
2.5
2.0 ICE = 8A 1.5
2.0 ICE = 8A 1.5
1.0
ICE = 2.5A
1.0
I CE = 2.5A
0.5 -40 -20 0 20 40 60 80
o
0.5 -40 -20 0 20 40 60 80 100
o
100
120
140
120
140
T J , JUNCTION TEMPERATURE ( C)
T J , JU N CTION TEMPER ATU R E ( C)
Figure 5. Collector to Emitter Saturation Voltage Vs. Junction Temperature
Figure 6. Collector to Emitter Saturation Voltage Vs. Junction Temperature
3 FGD2N40L Rev. A
www.fairchildsemi.com
FGD2N40L 400V N-Channel Logic Level IGBT
Typical Performance Characteristics
VCE, COLLECTOR TO EMITTER VOLTAGE (V)
7 6 5 4 3 2 1 0 1.0 1.5 2.0 2.5 ICE = 2.5A
DUTY CYCLE < 0.5% PULSE DURATION = 250s o TJ = -40 C
VCE, COLLECTOR TO EMITTER VOLTAGE (V)
8
8 7 6 5 4 3 2 1 0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 ICE = 2.5A ICE = 8A ICE = 15A DUTY CYCLE < 0.5% PULSE DURATION = 250s o TJ = 25 C
ICE = 15A ICE = 8A
3.0
3.5
4.0
4.5
5.0
VGE, GATE TO EMITTER VOLTAGE (V)
VGE, GATE TO EMITTER VOLTAGE (V)
Figure 7. Collector to Emitter On-State Voltage Vs. Gate to Emitter Voltage
Figure 8. Collector to Emitter On-State Voltage Vs. Gate to Emitter Voltage
VCE, COLLECTOR TO EMITTER VOLTAGE (V)
VCE, COLLECTOR TO EMITTER VOLTAGE (V)
8 7 6 5 4 3 2 1 ICE = 2.5A 0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 ICE = 8A ICE = 15A DUTY CYCLE < 0.5% PULSE DURATION = 250s o TJ = 70 C
8 7 6 5 4 3 ICE = 8A 2 1 0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 ICE = 2.5A DUTY CYCLE < 0.5% PULSE DURATION = 250s o TJ = 125 C
ICE = 15A
VGE, GATE TO EMITTER VOLTAGE (V)
VGE, GATE TO EMITTER VOLTAGE (V)
Figure 9. Collector to Emitter On-State Voltage Vs. Gate to Emitter Voltage
Figure 10. Collector to Emitter On-State Voltage Vs. Gate to Emitter Voltage
1.2
1000
ICE = 1m A V CE = V GE
GATE TO EMITTER THRESHOLD VOLTAGE
C IES
1.1
C, CAPACITANCE (pF)
VGE(TH), (NORMALIZED)
1.0
100
C OES
0.9
C RES
0.8
10
0.7
V GE = 0V , f = 1M H z T C = 25 C
o
0.6 -40 -20 0 20 40 60 80 100 120
o
1
140 160
0.1
1
10
100
T J , JUN CTION TEMPERATUR E( C)
V C E , C O LLEC TO R TO EM ITTE R V OLTA GE (V )
Figure 11. Normalized Gate to Emitter Threshold Voltage Vs. Junction Temperature
4 FGD2N40L Rev. A
Figure 12. Capacitance Vs. Collector to Emitter Voltage
www.fairchildsemi.com
FGD2N40L 400V N-Channel Logic Level IGBT
Typical Performance Characteristics
toff
toff
SWITCHING TIME (ns)
SWITCHING TIME (ns)
1000 ton
tfall
1000
tfall
trise 100
ton trise 100 VCE = 300V, VGE = 4V, ICE = 2.5A, TJ = 25 C
o
VCE = 300V, VGE = 4V, RGE = 51, TJ = 25 C 0 5 10 15 20 25
o
0
50
100
150
200
250
300
ICE, COLLECTOR TO EMITTER CURRENT (A)
RG, GATE RESISTANCE ()
Figure 13. Switching Time Vs. Collector Current
Figure 14. Switching Time Vs. Gate Resistance
10
VGE, GATE TO EMITTER VOLTAGE (V)
IC = 2.5A, VCC = 300V 8 T J = 25 C
o
ICE, COLLECTOR TO EMITTER CURRENT (A)
25 o 125 C 20 o 150 C 15 -40 C 10 o o 25 C
6
4
2
5
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
0 0 2 4 6 8 10 12
Qg, GATE CHARGE (nC)
V GE , GATE TO EMITTER VOLTAGE (V)
Figure 15. Gate Charge
BVces, (NORMALIZED) COLLECTOR TO EMITTER BREAKDOWN VOLTAGE
Figure 16. Transfer
1.12 1.10 1.08 1.06 1.04 1.02 1.00 0.98 0.96 0.94 0.92 -40 -20 0 20 40 60 80 100 120
o
ICE = 1mA
140
160
TJ, JUNCTION TEMPERATURE ( C)
Figure 17. Normalized Collector to Emitter Breakdown Voltage Vs. Junction Temperature
5 FGD2N40L Rev. A
www.fairchildsemi.com
FGD2N40L 400V N-Channel Logic Level IGBT
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
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FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I18
Preliminary
No Identification Needed
Full Production
Obsolete
Not In Production
(c)2006 Fairchild Semiconductor Corporation FGD2N40L Rev. A
6
www.fairchildsemi.com


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